Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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==Deposition of Silicon using sputter deposition== | ==Deposition of Silicon using sputter deposition== | ||
At Nanolab we can sputter silicon | At Nanolab we can sputter silicon with the Lesker Sputter systems (both the single chamber and dual chamber systems). One of the advantages of sputtering is that you can deposit on almost any material you like. | ||
* [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter deposition in the Wordentec]] | * [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter deposition in the Wordentec]] (tool now decommissioned but general results may still be of interest) | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | * [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC1)|Si sputter deposition in the Sputter-System Metal-Oxide(PC1)]] | * [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC1)|Si sputter deposition in the Sputter-System Metal-Oxide(PC1)]] | ||