Decommissioned Equipment

List of Decommissioned Equipment

Below is a list of decommissioned equipment that is kept as reference for other Equipment.

Characterization Equipment

• X-Ray Diffractometer
• KLA-Tencor Surfscan 6420

(replaced by Takano WM-7SR)

• Optical Profiler (Sensofar) acceptance test

Lithography Equipment

• PlasmaAsher1
• PlasmaAsher2
• Spin Track 1 + 2 processing

Thin Film Equipment

• Thin Film Deposition

• AlTi deposition in PVD co-sputter co-evaporation
• Deposition of low stress nitride using the 4" LPCVD nitride furnace

• Thermal Process

• RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
• APOX furnace - For growing of very thick oxide layers
• III-V Oven (D4) - For oxidation of Al_xGaAs layers.
• Old Resist Pyrolysis furnace - For pyrolysis of different resist
• Noble furnace - For annealing and oxidation of non-clean wafers

Dry Etch Equipment

• RIE (Reactive Ion Etch)

• Si etch using RIE1 or RIE2
• SiO2 etch using RIE1 or RIE2
• Etch of Silicon Nitride using RIE
• Images of 1SIO2mbr with burned resist mask
• RIE1 Travka results
• RIE2 Travka results

Other Equipment

• Electroplating-Ni
• Polymer Injection Molder