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| '''**''' ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.'' | | '''**''' ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.'' |
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| == Studies of Au deposition processes==
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| [[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec (machine now decommissioned, but results can still be of interest)''
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| ===Temperature rise due to Au e-beam evaporation===
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| In the Wordentec e-beam evaporation resulted in a temperature rise in the range of 40-80 degrees C according to temperature stickers on the backs of 6 wafers processed sequentially, rising as more wafers were processed. The throw distance (source-substrate distance) was around 45 cm in the Wordentec. The expected temperature rise in our Temescal systems would be assumed to be lower as the throw distance is longer.
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| == Resistive thermal evaporation of Au == | | == Resistive thermal evaporation of Au == |
