Decommissioned Equipment: Difference between revisions
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:* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | :* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | ||
:*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]] | :*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]] | ||
==Other Equipment== | |||
* [[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]] | |||
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