Decommissioned Equipment: Difference between revisions
Appearance
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==Thin Film Equipment== | ==Thin Film Equipment== | ||
* Thin Film Deposition | * Thin Film Deposition | ||
:*[[Specific Process Knowledge/Thin film deposition/Deposition of AlTi/AlTi deposition in PVD co-sputter co-evaporation|AlTi deposition in PVD co-sputter co-evaporation]] | |||
* Thermal Process | * Thermal Process | ||
Revision as of 15:45, 20 June 2025
List of Decommissioned Equipment
Below is a list of decommissioned equipment that is kept as reference for other Equipment.
Characterization Equipment
- (replaced by Takano WM-7SR)
Lithography Equipment
Thin Film Equipment
- Thin Film Deposition
- Thermal Process
- RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
- APOX furnace - For growing of very thick oxide layers
- III-V Oven (D4) - For oxidation of AlxGaAs layers.
- Old Resist Pyrolysis furnace - For pyrolysis of different resist
- Noble furnace - For annealing and oxidation of non-clean wafers