Decommissioned Equipment: Difference between revisions
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:* [[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE1 or RIE2]] | :* [[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE1 or RIE2]] | ||
:* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | :* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | ||
* | :*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]] | ||
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Revision as of 15:45, 20 June 2025
List of Decommissioned Equipment
Below is a list of decommissioned equipment that is kept as reference for other Equipment.
Characterization Equipment
- (replaced by Takano WM-7SR)
Lithography Equipment
Thin Film Equipment
- Thin Film Deposition
- Thermal Process
- RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
- APOX furnace - For growing of very thick oxide layers
- III-V Oven (D4) - For oxidation of AlxGaAs layers.
- Old Resist Pyrolysis furnace - For pyrolysis of different resist
- Noble furnace - For annealing and oxidation of non-clean wafers