Decommissioned Equipment: Difference between revisions
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==Thin Film Equipment== | ==Thin Film Equipment== | ||
* Thin Film Deposition | |||
* Thermal Process | |||
:*[[Specific Process Knowledge/Thermal Process/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si-based materials'' | |||
:*[[Specific Process Knowledge/Thermal Process/Furnace APOX|APOX furnace]] - ''For growing of very thick oxide layers'' | |||
:*[[Specific Process Knowledge/Thermal Process/D4 III-V Oven|III-V Oven (D4)]] - ''For oxidation of Al<sub>x</sub>GaAs layers.'' | |||
:*[[Specific Process Knowledge/Thermal Process/Resist Pyrolysis Furnace|Old Resist Pyrolysis furnace]] - ''For pyrolysis of different resist | |||
:*[[Specific Process Knowledge/Thermal Process/Furnace Noble|Noble furnace]] - ''For annealing and oxidation of non-clean wafers'' | |||
==Dry Etch Equipment== | ==Dry Etch Equipment== | ||