Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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 '''**'''  ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.''
-== Studies of Au deposition processes in the Wordentec==
+== Studies of Au deposition processes==
-[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec''
+[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec (machine now decommissioned, but results can still be of interest)''
-===Wafer temperature===
-The wafer temperature during e-beam deposition of 200 nm Au on six wafers has been measured using thermal labels on the backside of the wafers. The following results were obtained:
-{| border="1" cellspacing="0" cellpadding="2"
-! Wafer
-! Temperature [C]
-|-
-|1
-|48
-|-
-|2
-|60
-|-
-|3
-|65
-|-
-|4
-|71
-|-
-|5
-|71
-|-
-|6
-|77
-|-
-|}
-The temperatures are accurate within approximately +/- 3C and probably underestimating the actual wafer temperature slightly. It is observed that the wafer temperature increases with each wafer, thus if wafer temperature is of concern it is advised to reduce the number of wafers per run.
 == Resistive thermal evaporation of Au ==