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Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)|Al sputtering in Sputter System (Lesker)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)|Al sputtering in Sputter System (Lesker)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]
We also used to have Al sputtering in a system called the Wordentec, so we also have some information on that:
*[[/Sputter rates for Al|Sputtering of Aluminium in the Wordentec]]


==E-beam evaporation of Aluminium==
==E-beam evaporation of Aluminium==
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