Specific Process Knowledge/Characterization/Tencor P17: Difference between revisions
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= Tencor P17 (Stylus Profiler) = | = Tencor P17 (Stylus Profiler) = | ||
The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the Dektak XTA | The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the [[Specific Process Knowledge/Characterization/Dektak XTA|Dektak XTA]] profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement|stress]]. Both of these tools are inside the cleanroom. | ||
Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT. | Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT. | ||
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== Process information == | == Process information == | ||
*Info about [// | *Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy |measurement accuracy]] (''measured with Dektak XTA'') | ||
*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]] | *Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]] | ||
*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)'' | *Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)'' | ||
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|style="background:LightGrey; color:black"|Height accuracy z (95 % confidence) | |style="background:LightGrey; color:black"|Height accuracy z (95 % confidence) | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step '''for well-defined steps that are easy to measure''' (read about reducing and estimating the measurement uncertainty [[/ | ~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step '''for well-defined steps that are easy to measure''' (read about reducing and estimating the measurement uncertainty [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy |here]]) | ||
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|style="background:LightGrey; color:black"|Max scan depth as a function of trench width W | |style="background:LightGrey; color:black"|Max scan depth as a function of trench width W | ||