Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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*fast RF power supply | *fast RF power supply | ||
the etch and deposition cycles may be split into three separate phases, called Delay, Boost and Main. | the etch and deposition cycles may be split into three separate phases, called Delay, Boost and Main. | ||
[[Image:boostdelay4b.jpg |400x400px|thumb|The etch cycle is split into three parts: Boost, Delay and Main]] | [[Image:boostdelay4b.jpg |400x400px|thumb|The etch cycle is split into three parts: Boost, Delay and Main]] | ||
Following the arguments from above, the third phase (Delay) may be thought of as a short delay that ensures a very low pressure (and thus extremely good ion directionality) before the ion bombardment. | |||
===[[Advanced_Silicon_Etcher_-_Pegasus|Details on DRIE-Pegasus]]=== | ===[[Advanced_Silicon_Etcher_-_Pegasus|Details on DRIE-Pegasus]]=== | ||