Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions
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[[Category: Thin Film Deposition|IBE]] | [[Category: Thin Film Deposition|IBE]] | ||
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=IBE/IBSD Ionfab 300: Milling and Dry Etching = | |||
[[Image:IBE_IBSD_udstyret_i_RR1.jpg|300x300px|thumb|IBE and IBSD: positioned in cleanroom A-1, {{photo1}}]] | [[Image:IBE_IBSD_udstyret_i_RR1.jpg|300x300px|thumb|IBE and IBSD: positioned in cleanroom A-1, {{photo1}}]] | ||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=267 IBE/IBSD Ionfab 300+ in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=267 IBE/IBSD Ionfab 300+ in LabManager] | ||
=Process information= | |||
==Etch== | |||
*[http://www.semicore.com/reference/sputtering-yields-reference Compare sputter rates in different materials] | *[http://www.semicore.com/reference/sputtering-yields-reference Compare sputter rates in different materials] | ||
*[[/IBE process trends|Some general process trends]] | *[[/IBE process trends|Some general process trends]] | ||
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**[[/IBE blazed gratings|Etching of blazed gratings]] | **[[/IBE blazed gratings|Etching of blazed gratings]] | ||
===Deposition | ==Deposition== | ||
'''<p style="color:red;">Deposition has been decommissioned on the system.</p>''' | |||
*[[/Crystal Settings|Crystal Thickness Monitor Settings]] | *[[/Crystal Settings|Crystal Thickness Monitor Settings]] | ||
*Results from the acceptance test: | *Results from the acceptance test: | ||
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