Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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-==TPT Wire Bonder==
+==TPT HB100 Wire Bonder ==
-[[Image:bond head - wedge insert.jpg|100px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]]
+Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
-[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''
-The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
 '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
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-<!-- give the link to the equipment info page in LabManager: -->
+[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
-[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder]
 ==Ball Wire Bonder K&S 4524==