Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | ||
[[ | [[Media:WaferAfterWordentec.JPG|Delaminating Au film on thin E-beam resist]] | ||
===Thermal evaporation materials=== | ===Thermal evaporation materials=== | ||