Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions
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! | !Max. Scan Range xy | ||
|Line scan x: 1 µm to 200mm. | |Line scan x: 1 µm to 200mm. | ||
Map scan xy: up to the largest square that can be inscribed in an 8" wafer | Map scan xy: up to the largest square that can be inscribed in an 8" wafer | ||
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! | !Max. Scan Range z | ||
|up to 900 µm | |up to 900 µm | ||
|50 Å to 1 mm | |50 Å to 1 mm | ||
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! | !Resolution xy | ||
|down to 0.025 µm | |down to 0.025 µm | ||
|down to 0.003 µm | |down to 0.003 µm | ||
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! | !Resolution z | ||
|0.01, 0.08 or 0.6 Å depending on range (note resolution much below 1 Å is not so useful since it is far below the noise level) | |0.01, 0.08 or 0.6 Å depending on range (note resolution much below 1 Å is not so useful since it is far below the noise level) | ||
|1 Å, 10 Å, 40 Å or 160 Å depending on range | |1 Å, 10 Å, 40 Å or 160 Å depending on range | ||
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! | !Max. Scan Depth [µm] (as a function of trench width W) | ||
|0.866*(W[µm]-2µm) | |0.866*(W[µm]-2µm) | ||
|1.2*(W[µm]-5µm) | |1.2*(W[µm]-5µm) | ||
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! | !Standard Tip Radius | ||
|2 µm 60<sup>o</sup> cone | |2 µm 60<sup>o</sup> cone | ||
|5 µm 45<sup>o</sup> cone | |5 µm 45<sup>o</sup> cone | ||
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! | !Stress Measurement | ||
|Excellent capability | |Excellent capability | ||
|Can be done | |Can be done | ||
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! | !Surface Rroughness | ||
|Can be done on a line or map (parallel line scans) | |Can be done on a line or map (parallel line scans) | ||
|Can be done on a line scan | |Can be done on a line scan | ||
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! | !Substrate Size | ||
|up to 8" | |up to 8" | ||
|up to 6" | |up to 6" | ||
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! | !Allowed Materials | ||
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*Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials | *Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials | ||
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! | !Location | ||
|Cleanroom F-2 | |Cleanroom F-2 | ||
|Cleanroom B-1 | |Cleanroom B-1 | ||