Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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=Stress measurement= | =Stress measurement= | ||
The stress in a thin film can be quantified with a [ | The stress in a thin film can be quantified with a [//Characterization/Topographic_measurement profilometer] by measuring the wafer bow before and after deposition of the film. If the thin film is deposited on both sides of the wafer, you can measure the bow after deposition and again after removing the film from one of the sides. | ||
If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD|XRD]]. | If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD|XRD]]. | ||
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===When a thin film is deposited on one side of the wafer=== | ===When a thin film is deposited on one side of the wafer=== | ||
#Measure the thickness of the wafer | #Measure the thickness of the wafer | ||
#Make a pre-stress measurement. Measure the wafer bow on one of the stylus profilometers in the cleanroom, the ([[ | #Make a pre-stress measurement. Measure the wafer bow on one of the stylus profilometers in the cleanroom, the ([[//Dektak_XTA Dektak XTA]] or [[//Tencor_P17) P17 Stylus profiler]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer diameter) in two directions perpendicular to each other. Using the P17 profiler you can measure a full radially resolved map of the wafer stress with up to 5° resolution. | ||
#Deposit the thin film | #Deposit the thin film | ||
#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer). | #Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer). | ||