Specific Process Knowledge/Characterization/PL mapper: Difference between revisions
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It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data). | It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data). | ||
The user manual and contact information can be found in [http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper|'''LabManager'''] | |||
[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper] | |||
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