Specific Process Knowledge/Wafer Information: Difference between revisions
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<sup>{{fn|1}}</sup> ''SSP: single side polished''<br> | <sup>{{fn|1}}</sup> ''SSP: single side polished''<br> | ||
<sup>{{fn|2}}</sup> ''DSP: double side polished''<br> | <sup>{{fn|2}}</sup> ''DSP: double side polished''<br> | ||
<sup>{{fn|3}}</sup> ''Pre-processed wafers are wafers with various thicknesses of thermal oxides, LPCVD nitrides and Poly Si. | <sup>{{fn|3}}</sup> ''Pre-processed wafers are wafers with various thicknesses of thermal oxides, LPCVD nitrides and Poly Si. More details in the [http://labmanager.danchip.dtu.dk/function.php?module=Wafer&view=shop&page_id=16| Wafer Shop].'' | ||
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