Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
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===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ||
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' | The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process with slight modifications by Karen Birkelund.: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' | ||