Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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'''''All links to Kemibrug (SDS) and Labmanager Including APV, requires login.''''' | '''''All links to Kemibrug (SDS) and Labmanager Including APV, requires login.''''' | ||
[[Category: Equipment|Etch Wet Silicon Oxide]] | [[index.php?title=Category:Equipment|Etch Wet Silicon Oxide]] | ||
[[Category: Etch (Wet) bath|Silicon Oxide]] | [[index.php?title=Category:Etch (Wet) bath|Silicon Oxide]] | ||
==Wet Silicon Oxide Etch (BHF, HF and BOE 7:1 Etchant VLSI with Surfactant (wetting agent))== | ==Wet Silicon Oxide Etch (BHF, HF and BOE 7:1 Etchant VLSI with Surfactant (wetting agent))== | ||
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*Silicon nitride | *Silicon nitride | ||
*Poly silicon | *Poly silicon | ||
*Photoresist | *Photoresist delaminates | ||
*Blue film | *Blue film | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Photoresist | *Photoresist delaminates | ||
*Silicon nitride (Only on quartz wafers) | *Silicon nitride (Only on quartz wafers) | ||
*Poly silicon (Only on quartz wafers) | *Poly silicon (Only on quartz wafers) | ||