Specific Process Knowledge/Wafer cleaning: Difference between revisions
| Line 16: | Line 16: | ||
===Wafers that go into the high temperature furnaces=== | ===Wafers that go into the high temperature furnaces=== | ||
As a general rule all wafers that go into the high temperature furnaces need a full RCA clean directly before the furnace step. | As a general rule all wafers that go into the high temperature furnaces need a full RCA clean directly before the furnace step. | ||
There are, however, some exception to this rule. Please find more information on wafer cleaning before furnace processes [https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces here]. | |||
<br/> | <br/> | ||
<br/> | <br/> | ||