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Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions

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{| border="2" cellspacing="1" cellpadding="3" align="center"
! Nominal line width
! colspan="14" align="center"| Etched depths (nm)
|-
! 30 nm
|198
|231
|147
|214
|163
|227
|185
|170
|295
|
|
|
|
|-
!60 nm
|256
|308
|181
|305
|229
|253
|191
|185
|411
|
|
|
|
|-
!90 nm
|259
|335
|195
|342
|255
|251
|222
|253
|566
|
|
|
|
|-
!120 nm
|277
|346
|203
|357
|262
|257
|221
|278
|600
|
|
|
|-
!150 nm
|269
|341
|205
|369
|265
|262
|225
|280
|647
|
|
|
|
|-
! Nominal line width
! colspan="14" align="center"| Etch rates in trenches (nm/min)
|-
!30 nm
|79
|77
|74
|71
|82
|151
|93
|57
|59
|
|
|
|
|-
!60 nm
|102
|103
|91
|102
|115
|169
|96
|62
|82
|
|
|
|
|-
!90 nm
|104
|112
|98
|114
|128
|167
|111
|84
|113
|
|
|
|
|-
!120 nm
|111
|115
|102
|119
|131
|171
|111
|93
|120
|
|
|
|
|-
!150 nm
|108
|114
|103
|123
|133
|175
|113
|93
|129
|
|
|
|
|-
|
! colspan="14" align="center"| zep mask parameters
|-
! start (end)
| 110 (64)
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/180nmzep|178 (96)]]
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/180nmzep|180 (110)]]
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/180nmzep|180 (64)]]
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/180nmzep|180 (72)]]
| 110 (43)
| 110 (34)
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/180nmzep|180 (64)]]
| [[Specific Process Knowledge/Etch/ICP Metal Etcher/nanoetch/340nmzep|348 (53)]]
|
|
|
|
|-
! zep etch rate (nm/min)
| 18
| 27
| 35
| 39
| 54
| 45
| 38
| 39
| 59
|
|
|
|
|-
|}




*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch on DRIE-Pegasus]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch on DRIE-Pegasus]]
*[[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano1|1 - the first nanoetch]]
*[[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano1|1 - the first nanoetch]]