Specific Process Knowledge/Lithography/Strip: Difference between revisions

@@ Line 533: / Line 533: @@
 !  !! [[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]  !! [[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
 |-
-! scope=row| Process
+! scope=row style="text-align: left;" | Process
 | Wet resist strip || Metal lift-off process
 |-
-! scope=row| Chemical
+! scope=row style="text-align: left;" | Chemical
 | Remover 1165 (NMP) || Remover 1165 (NMP)
 |-
-! scope=row| Process temperature
+! scope=row style="text-align: left;" | Process temperature
 | Up to 65°C || Up to 65°C
 |-
-! scope=row| Substrate batch
+! scope=row style="text-align: left;" | Substrate batch
 | 1-25 wafers || 1-25 wafers
 |-
-! scope=row| Substrate size
+! scope=row style="text-align: left;" | Substrate size
 |
 *100 mm wafers
@@ Line 553: / Line 553: @@
 *150 mm wafers
 |-
-! scope=row| Materials allowed
+! scope=row style="text-align: left;" | Materials allowed
 |
 *Silicon