Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing: Difference between revisions

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-==Raster mode==
+Aligner: Maskless 04 is both a direct writer and not a direct laser writer. In Raster mode, it work like MLA 1, 2, and 3, where an image is projected onto the substrate surface, and stepped/scanned across the substrate in order to produce the entire pattern. In Vector mode, it is a direct laser writer, where a focused laser beam is moved across the substrate surface in order to trace out the pattern.
-Aligner: Maskless 01 is not a direct writer. In the maskless aligner, the exposure light is passed through a spatial light modulator, much like in a video projector, and projected onto the substrate, thus exposing an area of the design at a time. The substrate is exposed by stepping the exposure field across the substrate.
+The writing head of the Aligner: Maskless 04 moves only in the z-direction. Using a focusing system, the maskless aligner is able to do real-time autofocus. The defocus process parameter is used to compensate offsets in the focusing mechanism, and to optimize printing quality in different resists and varying thicknesses.
+<br/>The stage of the Aligner: Maskless 01 moves only in x and y. It has no theta-axis. All rotation during alignment is thus accomplished by transformation of the input design.
-The light source is a 10W 365nm LED with a FWHM of 8nm. The spacial light modulator is an 800 X 600 pixel digital micro-mirror device. The individual mirrors of the DMD are switched in order to represent the design, and are timed in order to yield the desired exposure dose, while taking into account illumination uniformity, soft-stitching, and possibly also sub-pixel features. This image is projected onto the substrate through a lens(system). The projected image yields a writing field of 400µm X 300µm, and thus a pixel size of 0.5µm X 0.5µm at wafer scale. This writing field is stepped across the substrate, in order to expose the entire design, each field overlapping slightly in order to minimize stitching errors.
+==Raster mode==
+In raster mode, the exposure light is passed through a spatial light modulator, much like in a video projector, and projected onto the substrate, thus exposing an area of the design at a time. The substrate is exposed by stepping the exposure field across the substrate.
-The writing head of the Aligner: Maskless 01 moves only in the z-direction. Using a pneumatic focusing system, the maskless aligner is able to do real-time autofocus. The defocus process parameter is used to compensate offsets in the focusing mechanism, and to optimize printing quality in different resists and varying thicknesses.
+The light source in Raster mode is a 6W 365nm LED. The spatial light modulator is an 800 X 600 pixel digital micro-mirror device. The individual mirrors of the DMD are switched in order to represent the design, and are timed in order to yield the desired exposure dose, while taking into account illumination uniformity, soft-stitching, and possibly also sub-pixel features. This image is projected onto the substrate through a lens(system). The projected image yields a writing field of 400µm X 300µm, and thus a pixel size of 0.5µm X 0.5µm at wafer scale. This writing field is stepped across the substrate, in order to expose the entire design, each field overlapping slightly in order to minimize stitching errors.
-The stage of the Aligner: Maskless 01 moves only in x and y. It has no theta-axis. All rotation during alignment is thus accomplished by transformation of the input design.
 ==Vector mode==
+In vector mode,
+The light source in Vector mode is a 120mW 405nm diode laser.
 =Process Parameters=