Specific Process Knowledge/Lithography/Descum: Difference between revisions
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==Comparison between single substrate processing and multi substrate processing== | ==Comparison between single substrate processing and multi substrate processing for plasma asher 4 & 5== | ||
Processing a single substrate using the standard descum settings will provide users with a relatively controllable and uniform process. Adding dummy substrates in close proximity with the process substrate will reduce the ashing rate and improve the uniformity: | Processing a single substrate using the standard descum settings will provide users with a relatively controllable and uniform process. Adding dummy substrates in close proximity with the process substrate will reduce the ashing rate and improve the uniformity: | ||
<gallery mode="packed-hover" heights="150"> | <gallery mode="packed-hover" heights="150"> | ||