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Specific Process Knowledge/Lithography/Descum: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,915 edits
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[[File:PA_descum_single_v2.png|400px|thumb|Ashing amount and ashing rate when processing a single 100 mm wafer.|right]]
[[File:PA_descum_single_v3.png|400px|thumb|Ashing amount and ashing rate when processing a single 100 mm wafer.|right]]
'''Single wafer ashing rate'''<br>
'''Single wafer ashing rate'''<br>
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{| class="wikitable"
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[[File:PA_descum_multi_v2.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]]
[[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]]
'''Multi wafer ashing rate'''<br>
'''Multi wafer ashing rate'''<br>
{| class="wikitable"
{| class="wikitable"
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