Specific Process Knowledge/Lithography/Strip: Difference between revisions
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==Process chamber pressure for plasma asher 4 & 5== | ==Process chamber pressure for plasma asher 4 & 5== | ||
[[File:PA_chamber_pressure_v3.png| | [[File:PA_chamber_pressure_v3.png|400px|thumb|Ashing rate as function of chamber pressure when processing a single substrate and when processing a full boat with 25 substrates. The green area covers the optimum range (~1.3 mbar) for both situations.|right]] | ||
The ashing rate is related to the chamber pressure during processing. Process development tests found that 1.3 mbar gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | The ashing rate is related to the chamber pressure during processing. Process development tests found that 1.3 mbar gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | ||