Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions

@@ Line 84: / Line 84: @@
 ==Etched too short==
+{| class="wikitable"
+|+
+!Middel of the wafer
+!Close to wafer edge
+|-
+|
+<gallery caption="S047671 30 s barc etch, 7:00 min Cr etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">
+File:S047671midt_cr_00.jpg
+File:S047671midt_cr_03.jpg
+File:S047671midt_cr_05.jpg
+File:S047671midt_cr_08.jpg
+File:S047671midt_cr_10.jpg
+File:S047671midt_cr_11.jpg
+File:S047671midt_cr_13.jpg
+</gallery>
+|
+<gallery caption="S047671 30 s barc etch, 7:00 min Cr etch, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">
+File:S047671_edge_03.jpg
+File:S047671_edge_01.jpg
+File:S047671_edge_05.jpg
+File:S047671_edge_08.jpg
+File:S047671_edge_09.jpg
+File:S047671_edge_10.jpg
+File:S047671_edge_12.jpg
+</gallery>
+|}