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Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,304 edits
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<gallery caption="S047676 X min, Feb-2025, 100 nm Cr mask, with 500 nm resist" widths="200px" heights="200px" perrow="4">
<gallery caption="S047676 X min, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="200px" heights="200px" perrow="4">
File:S047676midt_cr_01.jpg
File:S047676midt_cr_01.jpg
File:S047676midt_cr_02.jpg
File:S047676midt_cr_02.jpg
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<gallery caption="S047676 X min, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths="200px" heights="200px" perrow="4">
File:S047676edge_cr_01.jpg
File:S047676edge_cr_04.jpg
File:S047676edge_cr_06.jpg
File:S047676edge_cr_08.jpg
File:S047676edge_cr_11.jpg
File:S047676edge_cr_12.jpg
</gallery>


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