Specific Process Knowledge/Lithography/Strip: Difference between revisions

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 '''Single substrate:'''<br>
-Test using a single 100 mm wafer in the center of the process chamber shows that 30-80% nitrogen gives the highest ashing rate.
+Result: 30-80% nitrogen gives the highest ashing rate.
+Wafers: 1<br>
+Size: 100 mm<br>
+Boat position: Center of chamber<br>
+Test wafer position: middle of boat<br>
 Total gas flow rate: 500 sccm<br>
 Gas mix ratio: tested parameter<br>
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 Test using a boat of 25 100 mm wafers in the center of the process chamber shows that 50-70% nitrogen gives the highest ashing rate.
+Wafers: 25<br>
+Size: 100 mm<br>
+Boat position: Center of chamber<br>
+Test wafer position: middle of boat<br>
 Total gas flow rate: 200 sccm<br>
 Gas mix ratio: tested parameter<br>