Specific Process Knowledge/Lithography/Strip: Difference between revisions
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The ashing rate is related to the total gas flow rate during processing. Process development tests found that 200 sccm gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | The ashing rate is related to the total gas flow rate during processing. Process development tests found that 200 sccm gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | ||
Please note that the ashing rate for a full boat is approximately ten times slower, than | Please note that the ashing rate for a full boat is approximately ten times slower, than the processing time for a single substrate. | ||
'''Single substrate:'''<br> | '''Single substrate:'''<br> | ||