Specific Process Knowledge/Lithography/Strip: Difference between revisions
| Line 262: | Line 262: | ||
The ashing rate is related to the chamber pressure during processing. | The ashing rate is related to the chamber pressure during processing. | ||
Testing found that 1.3 mbar gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. Please note that the ashing rate for a full boat is approximately ten times slower, than when processing a single substrate. | Testing found that 1.3 mbar gives the highest ashing rate for both processing single substrates and when processing a full boat with 25 substrates. | ||
Please note that the ashing rate for a full boat is approximately ten times slower, than when processing a single substrate. | |||
'''Single substrate:'''<br> | '''Single substrate:'''<br> | ||