Specific Process Knowledge/Characterization/Particle Scanner Takano: Difference between revisions
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===Specifications=== | ===Specifications=== | ||
- Particles having a size between 79 nm um and 5 um can be detected. The minimum particle size can only be detected on smooth surfaces such as bare silicon wafers or wafers with thermal SiO2. | - Particles having a size between 79 nm um and 5 um can be detected. The minimum particle size can only be detected on smooth surfaces such as bare silicon wafers or wafers with thermal SiO2.<br /> | ||
- The detected particles sizes depends on the used gain setting.<br /> | - The detected particles sizes depends on the used gain setting.<br /> | ||
- Wafer cassettes are available for 4”, 6” and 8” wafers. For the 4” wafer cassette, an adapter has to be mounted on the indexer.<br /> | - Wafer cassettes are available for 4”, 6” and 8” wafers. For the 4” wafer cassette, an adapter has to be mounted on the indexer.<br /> | ||
- The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br /> | - The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br /> | ||
- Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br /> | - Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br /> | ||