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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,931 edits
Line 154: Line 154:
|-style="background:whitesmoke; color:black"
|-style="background:whitesmoke; color:black"
!Process pressure
!Process pressure
|0.8- 1.2mbar
|0.5-1.5 mbar
|0.5- 1.0mbar
|0.5-1.5 mbar
|0.5- 1.0mbar
|0.5-1.5 mbar
|0.8-1.5mbar
|0.5-1.5 mbar
|-
|-


Line 163: Line 163:
!Process gases
!Process gases
|
|
*O<sub>2</sub> (400 sccm)
*O<sub>2</sub> (140 sccm)
*N<sub>2</sub> (0-70 sccm)
*N<sub>2</sub> (60 sccm)
|
|
*O<sub>2</sub> (70-210 sccm)
*O<sub>2</sub> (70-210 sccm)
Line 174: Line 174:
|-style="background:whitesmoke; color:black"
|-style="background:whitesmoke; color:black"
!Process  power
!Process  power
|600-1000W
|1000 W
|150-300W
|150-1000 W
|150-300W
|150-1000 W
|1000W or less for heat- sensitive materials
|1000 W or less for heat- sensitive materials
|-
|-


|-style="background:silver; color:black"
|-style="background:silver; color:black"
!Process  time
!Process  time
|5-60 minutes
|5-90 minutes
|1-5 minutes
|1-10 minutes
|a few seconds to a few minutes
|seconds to minutes
|Between 0.5 and 20 hours, depending on the material
|Between 0.5 and 20 hours, depending on the material
|-
|-
Line 190: Line 190:
|-style="background:whitesmoke; color:black"
|-style="background:whitesmoke; color:black"
!Batch size
!Batch size
|1-30
|1-25
|1-10
|1-25
|1 wafer at a time
|1 wafer at a time
|1 wafer at a time, use a container, e.g Petri dish
|1 wafer at a time, use a container, e.g Petri dish
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