Specific Process Knowledge/Lithography/Strip: Difference between revisions
Appearance
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 3: Descum|Plasma Asher 3: Descum]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 3: Descum|Plasma Asher 3: Descum]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]</b> | |||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 5|Plasma Asher 5]]</b> | |||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Resist Strip|Resist strip]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Resist Strip|Resist strip]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</b> | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Resist descum | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Clean wafers only, no metal | Clean wafers only, no metal | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
All purposes | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Resist strip, no metal lift off | Resist strip, no metal lift off | ||
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|style="background:LightGrey; color:black"|Process gasses | |style="background:LightGrey; color:black"|Process gasses | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*O<sub>2</sub> ( | *O<sub>2</sub> (flow unknown) | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*O<sub>2</sub> (0 - | *O<sub>2</sub> (0-500 sccm) | ||
*N<sub>2</sub> | *N<sub>2</sub> (0-500 sccm) | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*O<sub>2</sub> ( | *O<sub>2</sub> (0-500 sccm) | ||
*N<sub>2</sub> (0-500 sccm) | |||
*CF<sub>4</sub> (0-200 sccm) | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*NA | *NA | ||
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|style="background:LightGrey; color:black"|Max. process power | |style="background:LightGrey; color:black"|Max. process power | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
100 W (100%) | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
150-1000 W | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
150-1000 W | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*NA | *NA | ||
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*1 small sample | *1 small sample | ||
*1 50 mm wafer | *1 50 mm wafer | ||
*1 | *1 100 mm wafer | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*1 small sample | *1 small sample | ||
*1 50 mm wafer | *1 50 mm wafer | ||
*1 - | *1-25 100 mm wafers | ||
*1 - 25 150 mm wafers | *1-25 150 mm wafers | ||
*1-25 200 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*1 small sample | *1 small sample | ||
*1 50 mm wafer | *1 50 mm wafer | ||
*1 100 mm | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | |||
*1-25 200 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*1 - 25 100 mm wafers | *1 - 25 100 mm wafers | ||
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*Film or pattern of all but Type IV | *Film or pattern of all but Type IV | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
<b>No | <b>No metals allowed! This includes metal oxides</b> | ||
*Silicon, glass, and polymer substrates | *Silicon, glass, and polymer substrates | ||
*Film or pattern of photoresist/polymer | *Film or pattern of photoresist/polymer | ||