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Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Pevo (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
2,329 edits
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|Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4.  
|Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4.  
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
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|Dry oxidation of 100 mm wafers and small samples
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|Dry and wet oxidation of 150 mm and 200 mm wafers
|Dry oxidation of silicon and annealing in N<sub>2</sub>. But the furnace is mainly being used for pyrolysis of different resists
|Dry oxidation of silicon and annealing in N<sub>2</sub>. But the furnace is mainly being used for pyrolysis of different resists
|Rapid thermal processing: RTA (annealing), RTO (oxidation), RTN (nitridation) and RTH (hydrogenation).
|Rapid thermal processing: RTA (annealing), RTO (oxidation), RTN (nitridation) and RTH (hydrogenation).
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
*Wet: Torch
*Wet: H<sub>2</sub>O (torch)
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
*Wet: Torch
*Wet: H<sub>2</sub>O (torch)
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
*Wet: Steamer
*Wet: H<sub>2</sub>O (steamer)
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
*Wet: Bubbler
*Wet: H<sub>2</sub>O (bubbler)
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*
*Dry: O<sub>2</sub>
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*
*Dry: O<sub>2</sub>
*Wet: H O<sub>2</sub>O (bubbler)
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
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*N<sub>2</sub>
*N<sub>2</sub>
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*
*N<sub>2</sub>
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*N<sub>2</sub>
*N<sub>2</sub>
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!Process temperature
!Process temperature
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*900 <sup>o</sup>C - 1150 <sup>o</sup>C
*800 <sup>o</sup>C - 1150 <sup>o</sup>C
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*900 <sup>o</sup>C - 1150 <sup>o</sup>C
*800 <sup>o</sup>C - 1150 <sup>o</sup>C
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*900 <sup>o</sup>C - 1150 <sup>o</sup>C
*800 <sup>o</sup>C - 1150 <sup>o</sup>C
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*900 <sup>o</sup>C - 1100 <sup>o</sup>C
*800 <sup>o</sup>C - 1100 <sup>o</sup>C
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*900 <sup>o</sup>C - 1150 <sup>o</sup>C
*800 <sup>o</sup>C - 1150 <sup>o</sup>C
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*
*400 <sup>o</sup>C - 1150 <sup>o</sup>C
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*
*800 <sup>o</sup>C - 1100 <sup>o</sup>C
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*25 <sup>o</sup>C - 1050 <sup>o</sup>C
*25 <sup>o</sup>C - 1050 <sup>o</sup>C
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