Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions

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 The procedure is as follows:
-When deposition on one side of the wafer:
+====When deposition on one side of the wafer:====
 #Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.
 #Deposite the thin film
+#Measure the wafer bow again:
+#*On the same profilometer as used for the pre-measurement.
+#*With the same recipe as used for the pre-mesurement.
+#*On the same position/positions on the wafer as the pre-measurement .
+#Measure the thickness  of the substrate
+#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer is possible).
+#Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement.
+====When deposition on both sides of the wafer:====
+#Deposite the thin film
+#Pre-measurement: Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.
+#Remove the thin film from one side of the wafer. If it is a single side polished wafer, remove it on the non-polished side.
 #Measure the wafer bow again:
 #*On the same profilometer as used for the pre-measurement.