Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | *[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | ||
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool'' | |||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | *[[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | ||