Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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#Deposite the thin film | #Deposite the thin film | ||
#Measure the wafer bow again: | #Measure the wafer bow again: | ||
# | #*On the same profilometer as used for the pre-measurement. | ||
# | #*With the same recipe as used for the pre-mesurement. | ||
# | #*On the same position/positions on the wafer as the pre-measurement . | ||
#Measure the thickness of the substrate | #Measure the thickness of the substrate | ||
#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer is possible). | #Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer is possible). | ||
#Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement. | #Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement. | ||