Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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Since substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems they are described in common below. Pattern preparation, job preparation and job execution are fairly different between the two tools and hence these steps are described on the specific tool pages. | Since substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems they are described in common below. Pattern preparation, job preparation and job execution are fairly different between the two tools and hence these steps are described on the specific tool pages. | ||
== Substrate preparation == | == Substrate preparation and resist information== | ||
Substrates must be prepared for EBL by applying an e-beam sensitive resist and possibly a discharge layer. Please consult the EBL substrate preparation guide on how to prepare your substrate and to find resist information. | Substrates must be prepared for EBL by applying an e-beam sensitive resist and possibly a discharge layer. Please consult the EBL substrate preparation guide on how to prepare your substrate and to find resist information. | ||