Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/SiO2 etch: Difference between revisions
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==Test work done== | ==Test work done== | ||
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The tests were done on 6" wafers. Siliocn wafers with 1µm thermal SiO2 and maskless. Measurements were done on the ellipsometer before at after the etch to map the etch rate. | |||
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