Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
| Line 323: | Line 323: | ||
* Metals including alloys and magnetic materials | * Metals including alloys and magnetic materials | ||
* Dielectrica including silica and alumina. | * Dielectrica including silica and alumina. | ||
* | * Semiconductors including silicon | ||
* See tables above and ask staff if there is a material you would like to deposit which you do not see listed. | * See tables above and ask staff if there is a material you would like to deposit which you do not see listed. | ||
|- | |- | ||