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Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"|
* Sputtering of metals including:
* Metals including alloys and magnetic materials
* alloys and magnetic metals
* Dielectrica including silica and alumina.  
* semiconductors including silicon
* Silicon
* dielectrica including silica and alumina.  
* See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
* See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
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