Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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 !style="background:silver; color:black;" align="left"|Purpose
 |style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"|
-*Sputtering of metals including alloys and magnetic metals, semiconductors including silicon, and some dielectrica. See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
+* Sputtering of metals including:
+* alloys and magnetic metals
+* semiconductors including silicon
+* dielectrica including silica and alumina.
+* See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance