Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
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*1-30 100 mm wafers | *1-30 100 mm wafers | ||
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* | *Single-wafer process | ||
* | *Chips on carrier | ||
*50 mm, 100 mm and 150 mm wafers | |||
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*1-30 50 mm, 100 mm or 150 mm wafers | *1-30 50 mm, 100 mm or 150 mm wafers | ||