Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
Appearance
No edit summary |
No edit summary |
||
| Line 2: | Line 2: | ||
!Recipe | !Recipe | ||
!nano1.0 | !nano1.0 | ||
!nano1.1 | |||
!nano1.2 | |||
!nano1.3 | |||
|- | |- | ||
!Tool | !Tool | ||
|Pegasus | |||
|Pegasus | |||
|Pegasus | |||
|Pegasus | |Pegasus | ||
|- | |- | ||
!C<sub>4</sub>F<sub>8</sub> (sccm) | !C<sub>4</sub>F<sub>8</sub> (sccm) | ||
|52 | |||
|52 | |||
|52 | |||
|52 | |52 | ||
|- | |- | ||
!SF<sub>6</sub> (sccm) | !SF<sub>6</sub> (sccm) | ||
|38 | |||
|38 | |||
|38 | |||
|38 | |38 | ||
|- | |- | ||
!O<sub>2</sub> (sccm) | !O<sub>2</sub> (sccm) | ||
|0 | |||
|0 | |||
|0 | |||
|0 | |0 | ||
|- | |- | ||
! Coil power (W) | ! Coil power (W) | ||
|800 (forward) | |800 (forward) | ||
|600 (forward) | |||
|800 (forward) | |||
|600 (forward) | |||
|- | |- | ||
!Platen power (W) | !Platen power (W) | ||
|50 | |50 | ||
|50 | |||
|50 | |||
|40 | |||
|- | |- | ||
! Pressure (mtorr) | ! Pressure (mtorr) | ||
|4 | |4 | ||
|4 | |||
|4 | |||
|4 | |||
|- | |- | ||
! Process time (s) | ! Process time (s) | ||
|120 | |||
|120 | |||
|120 | |||
|120 | |120 | ||
|- | |- | ||
| Line 32: | Line 58: | ||
|- | |- | ||
! 30 nm | ! 30 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!60 nm | !60 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!90 nm | !90 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!120 nm | !120 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!150 nm | !150 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
! Nominal line width | ! Nominal line width | ||
! colspan=" | ! colspan="4" align="center"| Etch rates in trenches (nm/min) | ||
|- | |- | ||
!30 nm | !30 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!60 nm | !60 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!90 nm | !90 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!120 nm | !120 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
!150 nm | !150 nm | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
| | | | ||
! colspan=" | ! colspan="4" align="center"| Etch rates in zep resist (nm/min) | ||
|- | |- | ||
! One point on wafer | ! One point on wafer | ||
| | |||
| | |||
| | |||
| | | | ||
|- | |- | ||
! Images | ! Images | ||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]] | |||
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]] | |||
|- | |- | ||
|} | |} | ||