Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10: Difference between revisions
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<gallery caption="The results of the nano1.0 recipe" widths="250" heights="200" perrow="3"> | <gallery caption="The results of the nano1.0 recipe" widths="250" heights="200" perrow="3"> | ||
image: | image:WF_2C3_feb2011_030.jpg|The 30 nm trenches | ||
image: | image:WF_2C3_feb2011_060.jpg|The 60 nm trenches | ||
image: | image:WF_2C3_feb2011_090.jpg|The 90 nm trenches | ||
image: | image:WF_2C3_feb2011_120.jpg|The 120 nm trenches | ||
image: | image:WF_2C3_feb2011_150.jpg|The 150 nm trenches | ||
C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs | C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs | ||
</gallery> | </gallery> |
Revision as of 09:29, 28 March 2011
The nano1.0 recipe
Recipe | Gas | C4F8 38 sccm, SF6 52 sccm |
---|---|---|
Pressure | 4 mTorr, Strike 3 secs @ 15 mTorr | |
Power | 800 W CP, 50 W PP | |
Temperature | 10 degs | |
Hardware | 100 mm Spacers | |
Time | 120 secs | |
Conditions | Run ID | 417, 418 and 419 |
Conditioning | Sequence: Oxygen clean, MU tests, processes, no oxygen between runs | |
Mask | 1dfhj10 nm zep etched down to 6dgh4 nm |
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The 30 nm trenches
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The 60 nm trenches
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The 90 nm trenches
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The 120 nm trenches
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The 150 nm trenches