Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10: Difference between revisions

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<gallery caption="The results of the nano1.0 recipe" widths="250" heights="200" perrow="3">
<gallery caption="The results of the nano1.0 recipe" widths="250" heights="200" perrow="3">
image:WF_2C5_feb2011_030.jpg|The 30 nm trenches
image:WF_2C3_feb2011_030.jpg|The 30 nm trenches
image:WF_2C5_feb2011_060.jpg|The 60 nm trenches
image:WF_2C3_feb2011_060.jpg|The 60 nm trenches
image:WF_2C5_feb2011_090.jpg|The 90 nm trenches
image:WF_2C3_feb2011_090.jpg|The 90 nm trenches
image:WF_2C5_feb2011_120.jpg|The 120 nm trenches
image:WF_2C3_feb2011_120.jpg|The 120 nm trenches
image:WF_2C5_feb2011_150.jpg|The 150 nm trenches
image:WF_2C3_feb2011_150.jpg|The 150 nm trenches
C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs
C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs
</gallery>
</gallery>

Revision as of 10:29, 28 March 2011

The nano1.0 recipe

Recipe nano1.0
Recipe Gas C4F8 38 sccm, SF6 52 sccm
Pressure 4 mTorr, Strike 3 secs @ 15 mTorr
Power 800 W CP, 50 W PP
Temperature 10 degs
Hardware 100 mm Spacers
Time 120 secs
Conditions Run ID 417, 418 and 419
Conditioning Sequence: Oxygen clean, MU tests, processes, no oxygen between runs
Mask 1dfhj10 nm zep etched down to 6dgh4 nm