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| [[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|.]] | | [[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|.]] |
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| == Some questions and answers ==
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| This section contains material from email correspondence with SPTS. The content is, at most, only slightly modified from the original emails and thus may appear somewhat sloppily written. You may, however, find some useful answers. The idea is to share valuable and useful information (instead of keeping it hidden deep in email correspondence).
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Hardware|Hardware and setup]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding|Bonding wafers]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Matching|Problems with matching]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Masks|Mask materials]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Nanoetch|Nanoetching]]
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Revision as of 14:11, 21 March 2011
This page is under construction
The DRIE-Pegasus takes the well established Bosch process known from the ASE a significant step further.
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