Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask: Difference between revisions

Revision as of 13:26, 3 November 2023 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,318 edits →Profile, top view at tilted SEM images ← Older edit		Revision as of 14:19, 3 November 2023 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,318 edits →Profile, top view at tilted SEM images Newer edit →
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	===Profile, top view at tilted SEM images===		===Profile, top view at tilted SEM images===
	<gallery caption="SiO2 etch with Cr mask on full wafer 6 min etch" perrow="6" widths="~~200px~~" heights="~~150px~~">		<gallery caption="SiO2 etch with Cr mask on full wafer 6 min etch" perrow="6" widths="400px" heights="300px">