Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions

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![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano3|Sinano3.0]]
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano3|Sinano3.0]]
!Sinano3.1
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano31|Sinano3.1]]
!Sinano3.2
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano32|Sinano3.2]]
!Sinano3.3
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinan33|Sinano3.3]]
!Sinano3.4
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano34|Sinano3.4]]
!Sinano4.0
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano4|Sinano4.0]]
!Sinano3.5
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano35|Sinano3.5]]
!Sinano3.6
![[Specific Process Knowledge/Etch/ICP Metal Etcher/Sinano36|Sinano3.6]]
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!Cl<sub>2</sub> (sccm)
!Cl<sub>2</sub> (sccm)

Revision as of 10:09, 16 March 2011

This page is under construction

Etching of nanostructures in silicon using the ICP Metal Etcher

Sinano3.0 Sinano3.1 Sinano3.2 Sinano3.3 Sinano3.4 Sinano4.0 Sinano3.5 Sinano3.6
Cl2 (sccm) 0 0 0 0 0 20 15 15
BCl3 (sccm) 5 3 5 5 5 0 5 5
HBr (sccm) 15 17 15 15 15 0 0 0
Coil power (W) 900 900 900 900 900 900 900 900
Platen power (W) 50 50 60 75 90 60 60 60
Process time (s) 150 180 120 180 120 90 120 180